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.1. Field of the Invention
The present invention relates to a method of producing a resin-sealed semiconductor device in which an internal circuit is resin-sealed with a resin and a resin-sealed semiconductor device produced by the method.
2. Description of the Related Art
In recent years, the sealing resin used for a resin-sealed semiconductor device has increasingly been made thinner from the viewpoint of downsizing and miniaturization and power consumption reduction of the semiconductor device. However, as the resin is made thinner, the effect of suppressing the thermal expansion of the resin is lowered, and therefore the resin warps due to the difference between the thermal expansion coefficient of the semiconductor chip and that of the resin. The resulting package warps greatly, impairing the reliability of the device.
For example, when a power semiconductor device, such as an IGBT (insulated gate bipolar transistor) or a MOS (insulated gate type field-effect transistor) in which a MOSFET gate electrode is disposed on a semiconductor chip, is used as the semiconductor chip to be sealed with a resin, the stress due to the thermal expansion of the semiconductor chip may be large because the gate electrode disposed on the chip is made of metal. As a result, the power semiconductor device warps and the coupling coefficient between the device and the substrate on which the device is mounted decreases.
To prevent such warpage, various methods have been proposed.
As described in, for example, Japanese Unexamined Patent Application Publication No. 8-267638, a method using a thermosetting resin as the material of the resin sealant to be coated on a semiconductor chip, and curing the resin at a high temperature has been proposed. In this method, however, since the time required for the curing process is long, the productivity of the device falls.
When the sealing resin is made of an epoxy resin, as described in, for example, Japanese Unexamined Patent Application Publication No. 9-75984, a resin composition for sealing a semiconductor chip and a method of producing the resin composition have been proposed. According to this method, when a semiconductor chip is sealed, the epoxy resin is supplied to an opened inner lead part (wiring terminal part) at the time of dispensing a resin composition and the resulting composition is cured.
In such methods, the
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